Cai Jun

发表

Wang Xichuan, Cai Jun, Yang Weili, 2005, 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis.

Ran Feng, Xu Mei-hua, Cai Jun, 2007, 2007 International Symposium on High Density packaging and Microsystem Integration.

Ran Feng, Xu Meihua, Cai Jun, 2008, 2008 International Conference on Electronic Packaging Technology & High Density Packaging.

Cai Jun, Wang Pingyang, Lu Dezheng, 1998, POWERCON '98. 1998 International Conference on Power System Technology. Proceedings (Cat. No.98EX151).