Lin Tan

Characterization of stencil printing parameters for fine pitch wafer bumping

Q. Wang, Jian Cai, Ziyu Liu, 2014, 2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy.

Characterization of stencil printing parameters for fine pitch wafer bumping

Qian Wang, Jian Cai, Ziyu Liu, 2014, 2014 15th International Conference on Electronic Packaging Technology.

Study of viscoelastic effect of EMC on FBGA block warpage by FEA simulation

Q. Wang, Shuidi Wang, Jian Cai, 2013, 2013 14th International Conference on Electronic Packaging Technology.

Investigation on FBGA block warpage by Finite Element Simulation

Q. Wang, Shuidi Wang, Jian Cai, 2012 .

Plasma combined self-assembled monolayer pretreatment on electroplated-Cu surface for low temperature Cu–Sn bonding in 3D integration

Junqiang Wang, Jian Cai, Zijian Wu, 2017 .

Surface recombination property of silicon wafers determined accurately by self-normalized photocarrier radiometry

Li-guo Wang, L. Gong, Ya-qing Li, 2022, Infrared Physics & Technology.

Performance and reliability study of Pd-coated copper wire bonding on ENEPIG substrate

Shuidi Wang, Jian Cai, Jingwei Li, 2013, 2013 14th International Conference on Electronic Packaging Technology.

Low Temperature Cu-Cu Bonding Using Ag Nanostructure for 3D Integration

Jian Cai, Yang Hu, Ziyu Liu, 2015 .

Low temperature Cu-Cu bonding using Ag nanoparticles by PVD

Jian Cai, Ziyu Liu, Zijian Wu, 2016, 2016 6th Electronic System-Integration Technology Conference (ESTC).