Gapseop Sim

Wafer-level Vacuum Packaging of a MEMS Resonator using the Three-layer Bonding Technique

Chung-Mo Yang, H. Kim, Jong Cheol Park, 2020 .

Flexible and Disposable Sensing Platforms Based on Newspaper.

Soon Woo Jeong, Kyoung G. Lee, C. Kim, 2016, ACS applied materials & interfaces.

Implementation of Flip-Chip Microbump Bonding between InP and SiC Substrates for Millimeter-Wave Applications

S. Kong, Jongwon Lee, H. Ko, 2022, Micromachines.

Reproduction of Biomimetic Structural Colors via µm‐Scale Ni Textures

Jongcheol Park, Jong-Kown Lee, Gapseop Sim, 2023, Advanced Optical Materials.

Fabrication of newspaper-based potentiometric platforms for flexible and disposable ion sensors.

Seok Jae Lee, Nam Ho Bae, Yong-Jun Oh, 2017, Journal of colloid and interface science.

Batch-fabricated CO gas sensor in large-area (8-inch) with sub-10 mW power operation

Jun‐Bo Yoon, Min-Ho Seo, Jae-Young Yoo, 2019, Sensors and Actuators B: Chemical.

A bilayer Al nanowire-grid polarizer integrated with an IR-cut filter

Jae Hong Park, I. Kang, Hyun-Ik Jang, 2019 .