H. Y. Zhang

Thermal management of high power dissipation electronic packages: from air cooling to liquid cooling

Damaruganath Pinjala, Poi-Siong Teo, D. Pinjala, 2003, Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003).

Thermal modeling and design of liquid cooled heat sinks assembled vvith flip chip ball grid array packages

D. Pinjala, Kok Chuan Toh, T. N. Wong, 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

A Global Mass Correction Scheme for the Level-Set Method

John C. Chai, T. N. Wong, Yit Fatt Yap, 2006 .

An exact solution of extended Graetz problem with axial heat conduction

M. A. Ebadian, M. Ebadian, H. Zhang, 1989 .

Effective thermal conductivity model for TSVs with insulation layer as contact resistance

Tingyu Lin, H. Y. Zhang, Y. S. Wang, 2015, 2015 16th International Conference on Electronic Packaging Technology (ICEPT).

A Procedure for the Motion of Particle-Encapsulated Droplets in Microchannels

Y. F. Yap, T. N. Wong, L. Yobas, 2008 .

Thermal characterization and simulation study of 2.5D packages with multi-chip module on through silicon interposer

Liang Ding, X. W. Zhang, S. Lim, 2013, 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013).