P. Damaruganath

A Pluggable Large Core Step Index Plastic Optical Fiber With Built-In Mode Conditioners for Gigabit Ultra Short Reach Networks

J. Lau, J. Chandrappan, Z. Jing, 2010, IEEE Transactions on Advanced Packaging.

Process and Reliability of Embedded Micro-Wafer-Level Package (EMWLP) Using Low Cure Temperature Dielectric Material

V. N. Sekhar, V. S. Rao, G. Sharma, 2012, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Disposable Polydimethylsioxane Package for 'Bio~Microfluidic System'

M. Iyer, H. Ji, Yu Chen, 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

Effect of TSV interposer on the thermal performance of FCBGA package

John H. Lau, Kripesh Vaidyanathan, C. T. Chong, 2009, 2009 11th Electronics Packaging Technology Conference.

Development of Large Die Fine-Pitch Cu/Low- $k$ FCBGA Package With Through Silicon via (TSV) Interposer

Tai Chong Chai, Shiguo Liu, Yue Ying Ong, 2011, IEEE Transactions on Components, Packaging and Manufacturing Technology.

TSV interposer fabrication for 3D IC packaging

Vempati Srinivasa Rao, Li Hong Yu, C. T. Chong, 2009, 2009 11th Electronics Packaging Technology Conference.