Hsi-Ching Wang
发表
Jwo-Huei Jou,
Szu-Hao Chen,
Shih-Ming Shen,
2009
.
J. Jou,
Ming-Hsuan Wu,
Shih-Ming Shen,
2010
.
T. Chuang,
Hsi-Ching Wang,
Hsing-Hua Tsai,
2013,
Journal of Electronic Materials.
J. Shyue,
J. Jou,
Ming-Hsuan Wu,
2010
.
Hsin-Jung Lin,
T. Chuang,
Hsi-Ching Wang,
2013,
2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
Che-Cheng Chang,
T. Chuang,
Tung-Han Chuang,
2012,
2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT).
Che-Cheng Chang,
T. Chuang,
Tung-Han Chuang,
2012
.
Effects of Annealing Twins on the Grain Growth and Mechanical Properties of Ag-8Au-3Pd Bonding Wires
Che-Cheng Chang,
T. Chuang,
Tung-Han Chuang,
2012,
Journal of Electronic Materials.
Hsin-Jung Lin,
T. Chuang,
Hsi-Ching Wang,
2015,
Journal of Electronic Materials.
Hsin-Jung Lin,
T. Chuang,
Hsi-Ching Wang,
2013,
Metallurgical and Materials Transactions A.
C. S. Liu,
Wei-Heng Lin,
Chung-Hao Tsai,
2015,
2015 IEEE International Electron Devices Meeting (IEDM).