Wanxue Zeng

High aspect ratio Bosch etching of sub-0.25 μm trenches for hyperintegration applications

O. L. Russo, E. Eisenbraun, Xiaodong Wang, 2007 .

Low-temperature plasma-enhanced atomic layer deposition growth of WN_xC_y from a novel precursor for barrier applications in nanoscale devices

E. Eisenbraun, Xiaodong Wang, Sunil Kumar, 2007 .

Sub-0.25 micron silicon via etching for 3D interconnects

Eric Eisenbraun, Xiaodong Wang, E. Eisenbraun, 2007 .

CVD of Tantalum Oxide Dielectric Thin Films for Nanoscale Device Applications

H. Frisch, E. Eisenbraun, A. Kaloyeros, 2004 .

Preparation of rare-earth thulium doped tin-oxide thin films and their applications in thin film transistors

Jingjing Shao, Yanbing Han, Qun Zhang, 2019, Applied Surface Science.

Plasma-Assisted Atomic Layer Deposition of Conductive Hafnium Nitride Using Tetrakis(ethylmethylamino)hafnium for CMOS Gate Electrode Applications

E. Eisenbraun, N. Berliner, S. Consiglio, 2008 .

Low temperature inorganic chemical vapor deposition of Ti-Si-N diffusion barrier liners for gigascale copper interconnect applications

E. Eisenbraun, A. Kaloyeros, D. Anjum, 2000 .