M. Kunisu
发表
Y. Nishina,
M. Kunisu,
J. Yahiro,
2020
.
Katsutoshi Sato,
Y. Takita,
Katsutoshi Nagaoka,
2013
.
I. Tanaka,
T. Mizoguchi,
W. Ching,
2004
.
I. Tanaka,
T. Mizoguchi,
H. Adachi,
2004
.
S. Shikata,
K. Yamaguchi,
Y. Tamenori,
2017
.
I. Tanaka,
T. Mizoguchi,
W. Ching,
2003,
Micron.
Shingo Ogawa,
M. Kunisu,
J. Sameshima,
2019,
Materials Science Forum.
C. Bielawski,
Y. Nishina,
Hideyuki Suzuki,
2017
.
I. Tanaka,
H. Adachi,
F. Oba,
2002
.
Y. Morisada,
H. Fujii,
Xiaopei Wang,
2023,
Science and Technology of Welding and Joining.
Electronic structure characterization of La incorporated Hf-based high-k gate dielectrics by NEXAFS.
H. Arimura,
K. Kita,
Heiji Watanabe,
2011,
Journal of nanoscience and nanotechnology.
I. Tanaka,
T. Okajima,
M. Kunisu,
2006
.
I. Tanaka,
T. Mizoguchi,
Takeo Suga,
2004
.