Ruoh-Huey Uang

Process-dependent Thermal-mechanical Analysis and Design of a Novel Nanowire-based Anisotropic Conductive Film Assembly

Hsien-Chie Cheng, Chieh-Sheng Lin, Hsien-Chie Cheng, 2006, 2006 International Microsystems, Package, Assembly Conference Taiwan.

On the Thermal–Mechanical Behaviors of a Novel Nanowire-Based Anisotropic Conductive Film Technology

Yung-Yu Hsu, Hsien-Chie Cheng, Chieh-Sheng Lin, 2009, IEEE Transactions on Advanced Packaging.

Investigation of electroplating Ni UBM for Pb-free solders

Shu-Ming Chang, Yu-Hua Chen, Hsun Hu, 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

Mechanical material characterization of Co nanowires and their nanocomposite

Hsien-Chie Cheng, Jiong-Shiun Hsu, Hsien-Chie Cheng, 2008 .