S. Chakravarty

Surface-based finite element method for large-scale 3D circuit modeling

Changhong Dai, D. Jiao, S. Chakravarty, 2005, IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005..

Experimental validation of crosstalk simulations for on-chip interconnects at high frequencies using S-parameters

Dan Jiao, S. Chakravarty, M.J. Kobrinsky, 2003, Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710).

An extrapolation technique for predicting the RCS characteristics of large objects using the genetic algorithm and Prony's method

Raj Mittra, S. Chakravarty, Elif Aydin, 2001 .

Application of the micro-genetic algorithm to the design of spatial filters with frequency-selective surfaces embedded in dielectric media

Raj Mittra, S. Chakravarty, R. Mittra, 2002 .

Design of a frequency selective surface (FSS) with very low cross-polarization discrimination via the parallel micro-genetic algorithm (PMGA)

Raj Mittra, S. Chakravarty, R. Mittra, 2003 .

A novel technique for full-wave modeling of large-scale three-dimensional high-speed on/off-chip interconnect structures

D. Jiao, S. Chakravarty, M.J. Kobrinsky, 2003, International Conference on Simulation of Semiconductor Processes and Devices, 2003. SISPAD 2003..

Experimental validation of crosstalk simulations for on-chip interconnects using S-parameters

D. Jiao, S. Chakravarty, M.J. Kobrinsky, 2005, IEEE Transactions on Advanced Packaging.

A novel approach to delay calculations in interconnect structures

Raj Mittra, S. Chakravarty, Soon Jae Kwon, 2000, IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.00TH8524).

Application of micro-genetic algorithm (MGA) to a class of electromagnetic analysis and synthesis problems

Raj Mittra, S. Chakravarty, Junho Yeo, 2002, IEEE Antennas and Propagation Society International Symposium (IEEE Cat. No.02CH37313).

Design of microwave filters using a binary-coded genetic algorithm

Raj Mittra, S. Chakravarty, R. Mittra, 2000 .

An Efficient 3D-to-2D Reduction Technique for Frequency-Domain Layered Finite Element Analysis of Large-Scale High-Frequency Integrated Circuits

Dan Jiao, Feng Sheng, S. Chakravarty, 2007, 2007 IEEE Electrical Performance of Electronic Packaging.

A Fast Frequency-Domain Eigenvalue-Based Approach to Full-Wave Modeling of Large-Scale Three-Dimensional On-Chip Interconnect Structures

Dan Jiao, Jianfang Zhu, S. Chakravarty, 2008, IEEE Transactions on Advanced Packaging.

Stability characteristics of absorbing boundary conditions in microwave circuit simulations

Raj Mittra, Wenhua Yu, S. Chakravarty, 2001 .

A Layered Finite Element Method for Electromagnetic Analysis of Large-Scale High-Frequency Integrated Circuits

Changhong Dai, D. Jiao, S. Chakravarty, 2007, IEEE Transactions on Antennas and Propagation.

Reciprocity approach to pattern computation of microstrip antennas operating in a complex environment

R. Mittra, S. Dey, S. Chakravarty, 1998, IEEE Antennas and Propagation Society International Symposium. 1998 Digest. Antennas: Gateways to the Global Network. Held in conjunction with: USNC/URSI National Radio Science Meeting (Cat. No.98CH36.