W. Lawton

Performance and reliability of a three-dimensional plastic moulded vertical multichip module (MCM-V)

J. Barrett, C. Val, F. Waldron, 1995, 1995 Proceedings. 45th Electronic Components and Technology Conference.

The importance of molding compound chemical shrinkage in the stress and warpage analysis of PQFPs

C. Lyden, J. Barrett, H. Pape, 1995 .

Methods of analysing thermomechanical stress in plastic packages for integrated circuits

C. Lyden, John Barrett, G. Kelly, 1995 .

The importance of molding compound chemical shrinkage in the stress and warpage analysis of PQFPs

C. Lyden, J. Barrett, W. Lawton, 1995, 1995 Proceedings. 45th Electronic Components and Technology Conference.

Accurate prediction of PQFP warpage

C. Lyden, J. Expósito, J. Barrett, 1994, Workshop on MCM and VLSI Packaging Techniques and Manufacturing Technologies.

Accurate prediction of PQFP warpage

C. Lyden, J. Barrett, G. Kelly, 1994, 1994 Proceedings. 44th Electronic Components and Technology Conference.