K. Suganuma

Low-temperature low-pressure die attach with hybrid silver particle paste

K. S. Kim, S. Sakamoto, K. Suganuma, 2012, Microelectron. Reliab..

OVERVIEW OF THE RF SYSTEM FOR THE JAERI/KEK HIGH- INTENSITY PROTON LINAC

H. Nakanishi, Shinichiro Michizono, K. Suganuma, 2002 .

Improvement in high-temperature degradation by isotropic conductive adhesives including Ag-Sn alloy fillers

K. Suganuma, M. Yamashita, K. Suganuma, 2006, Microelectron. Reliab..

Development of oil-dissolved hydrogen gas detector for diagnosis of transformers

K. Suganuma, Yasuo Inoue, M. Kamba, 1990 .

RF performance test and current operations of LHRF and ICRF heating systems on JT-60

Takashi Kato, K. Suganuma, Sunao Maebara, 2008 .

Degradation by Sn diffusion applied to surface mounting with Ag-epoxy conductive adhesive with joining pressure

K. Suganuma, M. Yamashita, K. Suganuma, 2006, Microelectronics and reliability.

Effects of fourth alloying additive on microstructures and tensile properties of Sn-Ag-Cu alloy and joints with Cu

K. S. Kim, K. Suganuma, K. S. Kim, 2003, Microelectron. Reliab..