P. Dupuy

The effect of electro-thermal fatigue on the structure of power electronic devices. Micro-structural evolution of the metallization layer

C. Levade, B. Khong, M. Legros, 2009 .

On the Failure of Intelligent Power Devices Induced by Extreme Electro-Thermal Fatigue. A Microstructural Analysis

C. Levade, B. Khong, M. Legros, 2007 .

Alterations induced in the structure of intelligent power devices by extreme electro-thermal fatigue

Philippe Dupuy, Marc Legros, Colette Levade, 2007 .

In-depth investigation of metallization aging in power MOSFETs

R. Ruffilli, Mounira Berkani, Philippe Dupuy, 2015, Microelectron. Reliab..

Characterization of alterations on power MOSFET devices under extreme electro-thermal fatigue

Philippe Dupuy, Marc Legros, Colette Levade, 2010, Microelectron. Reliab..

Universal mechanisms of Al metallization ageing in power MOSFET devices

Marc Legros, Philippe Dupuy, Colette Levade, 2014, Microelectron. Reliab..

Characterization and modelling of ageing failures on power MOSFET devices

Marc Legros, Patrick Tounsi, Benjamin Khong, 2007, Microelectron. Reliab..

New method for electrothermal simulations: HDTMOS in automotive applications

X. Chauffleur, P. Tounsi, J.M. Dorkel, 2004, Twentieth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (IEEE Cat. No.04CH37545).

Mechanisms of power module source metal degradation during electro-thermal aging

R. Ruffilli, Mounira Berkani, Philippe Dupuy, 2017, Microelectron. Reliab..

3D Electro-thermal modelling of bonding and metallization ageing effects for reliability improvement of power MOSFETs

Philippe Dupuy, Patrick Tounsi, Jean-Marie Dorkel, 2011, Microelectron. Reliab..

Aluminum metallization and wire bonding aging in power MOSFET modules

Mounira Berkani, Philippe Dupuy, Stéphane Lefebvre, 2018 .

3-D electrothermal simulation of active cycling on smart power MOSFETs during short-circuit and UIS conditions

Michele Riccio, Andrea Irace, Mounira Berkani, 2014, Microelectron. Reliab..