A. Hubbard

Wafer-scale oxide fusion bonding and wafer thinning development for 3D systems integration: Oxide fusion wafer bonding and wafer thinning development for TSV-last integration

R. Hannon, S. Kanakasabapathy, A. Upham, 2012, 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration.

High performance extremely thin SOI (ETSOI) hybrid CMOS with Si channel NFET and strained SiGe channel PFET

M. Vinet, L. Grenouillet, T. Nagumo, 2012, 2012 International Electron Devices Meeting.