Wen Liu

Reliability Improvement of a Double-Sided IGBT Module by Lowering Stress Gradient Using Molybdenum Buffers

G. Lu, Meiyu Wang, Xin Li, 2019, IEEE Journal of Emerging and Selected Topics in Power Electronics.

Design and Characterizations of a Planar Multichip Half-Bridge Power Module by Pressureless Sintering of Nanosilver Paste

G. Lu, Meiyu Wang, Xin Li, 2019, IEEE Journal of Emerging and Selected Topics in Power Electronics.

A Reliable Double-Sided 1200-V/600-A Multichip Half-bridge Insulated Gate Bipolar Transistor (IGBT) Module with High Power Density

G. Lu, Xin Li, Y. Mei, 2018, 2018 1st Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia).

A Reliable Double-Sided 1200-V/600-A Multichip Half-bridge Insulated Gate Bipolar Transistor (IGBT) Module with High Power Density

G. Lu, Xin Li, Y. Mei, 2018, 2018 1st Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia).

Effects of sintering temperature on properties of toroid cores using NiZnCu ferrites for power applications at >1 MHz

G. Lu, F. Hou, Xin Li, 2018 .