W. Hsu

Applying novel non-destructive failure analysis techniques on the package related failures

P. S. Kuo, Y. T. Lin, C. H. Chu, 2016, 2016 17th International Conference on Electronic Packaging Technology (ICEPT).

Particle Size Effect on the Packaging Performance of YAG:Ce Phosphors in White LEDs

C. L. Lin, Ru‐Shi Liu, N. Bagkar, 2009 .