J. H. Okura

Guidelines to select underfills for flip chip on board assemblies and compliant interposers for chip scale package assemblies

J.F.J.M. Caers, Abhijit Dasgupta, T. Reinikainen, 2000 .

Guidelines to select underfills for flip chip on board assemblies

J.F.J.M. Caers, Abhijit Dasgupta, S. Shetty, 1999, 1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299).

Impact of underfill filler particles on reliability of flip chip interconnects

Abhijit Dasgupta, J. H. Okura, K. Darbha, 1997 .

Hygro-Mechanical Durability of Underfilled Flip-Chip-on-Board (FCOB) Interconnects

J.F.J.M. Caers, Abhijit Dasgupta, A. Dasgupta, 2002 .