H. H. Ma

Failure analysis methodology for the localization of thin and ultra-thin metal barrier residue

G. B. Ang, Z. H. Mai, A. C. T. Quah, 2014, Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA).

Failure analysis methodology on donut pattern failure due to photovoltaic electrochemical effect

Jeffrey Lam, C. Q. Chen, G. B. Ang, 2017, Microelectron. Reliab..