Mei-Lun Wu

Effect of metal finishing fabricated by electro and Electroless plating process on reliability performance of 30μm-pitch solder micro bump interconnection

John H. Lau, Chau-Jie Zhan, Shin-Yi Huang, 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

Effects of UBM structure/material on the reliability performance of 3D chip stacking with 30μm-pitch solder micro bump interconnections

Kuo-Shu Kao, J. H. Lau, Chau-Jie Zhan, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.