K. Hempel

发表

Taking SOI substrates and low-k dielectrics into high-volume microprocessor production

G. Burbach, D. Greenlaw, E. Langer, 2003, IEEE International Electron Devices Meeting 2003.

Integration and optimization of embedded-sige, compressive and tensile stressed liner films, and stress memorization in advanced SOI CMOS technologies

D. Greenlaw, H.-J. Engelmann, N. Kepler, 2005, IEEE InternationalElectron Devices Meeting, 2005. IEDM Technical Digest..

Techniques for picosecond OBIC measurement on ICs

U. Stamm, H. Bergner, A. Krause, 1992 .

High performance 65 nm SOI technology with enhanced transistor strain and advanced-low-K BEOL

J. Gill, D. Mocuta, D. Greenlaw, 2005, IEEE InternationalElectron Devices Meeting, 2005. IEDM Technical Digest..