D.R. Edwards

Experimental Evaluations of the Strength of Silicon Die by 3-Point-Bend Versus Ball-on-Ring Tests

V. Gupta, D. Edwards, Jie-Hua Zhao, 2008, IEEE Transactions on Electronics Packaging Manufacturing.

Effect of Dicing Technique on the Fracture Strength of Si Dies With Emphasis on Multimodal Failure Distribution

Seung-Hyun Chae, P. Ho, D. Edwards, 2010, IEEE Transactions on Device and Materials Reliability.

Constitutive Behavior of Sn3.8Ag0.7Cu and Sn1.0Ag0.5Cu Alloys at Creep and Low Strain Rate Regimes

V. Gupta, G. Subbarayan, D. Bhate, 2008, IEEE Transactions on Components and Packaging Technologies.

Multichip assembly with flipped integrated circuits

A.M. Wilson, D.R. Edwards, K.G. Heinen, 1989, Proceedings., 39th Electronic Components Conference.