Hong Wang

Numerical Simulation and Experimental Verification of Additive Distribution in Through-Silicon Via during Copper Filling Process

Guifu Ding, Yazhou Zhang, P. Cheng, 2015 .

Study of a novel cathode tool structure for improving heat removal in electrochemical micro-machining

Guifu Ding, Xiaolin Zhao, Ping Cheng, 2012 .

Laminated Photoresist Sacrificial Layer Process for 3-D Movable Suspension Microstructures in LIGA-Based Surface Micromachining

Guifu Ding, Congchun Zhang, G. Ding, 2010 .

A new method for the micro-tensile testing of thin film

Guifu Ding, Rui Liu, Chunsheng Yang, 2008, 2008 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems.

Modeling, Simulation and Characterization of a Micromachined Acceleration Switch With Anti-Stiction Raised Strips on the Substrate

Guifu Ding, Haogang Cai, Xiaolin Zhao, 2011, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Copper electroplating technique for efficient manufacturing of low-cost silicon interposers

Guifu Ding, Yazhou Zhang, Yunna Sun, 2016 .

A novel method for improving the adhesion strength of the electrodeposited Ni films in MEMS

Guifu Ding, Xiaolin Zhao, Rui Liu, 2011 .

Thermal effects of TSV (through silicon via) with void

Yan Wang, Guifu Ding, Yunna Sun, 2014, 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC).

Optimization of innovative approaches to the shortening of filling times in 3D integrated through-silicon vias (TSVs)

Guifu Ding, Rui Liu, Yazhou Zhang, 2015 .