Yong Sung Park

Effect of Ag Addition on the Ripening Growth of ${\rm Cu}_{6}{\rm Sn}_{5}$ Grains at the Interface of Sn-xAg-0.5Cu/Cu During a Reflow

Kyung-Wook Paik, Sun-Kyoung Seo, Hyuck-Mo Lee, 2011, IEEE Transactions on Components, Packaging and Manufacturing Technology.