F. Kawashiro

Effect of copper over-pad metallization on reliability of aluminum wire bonds

H. Nishikawa, M. Yoshikawa, F. Kawashiro, 2019, Microelectronics Reliability.

Mechanical Shock Durability Studies of Sn–Ag–Cu–Ni BGA Solder Joints on Electroless Ni–P/Au Surface Finish

Hiroshi Okada, F. Kawashiro, H. Yanase, 2009 .

Investigation of Formation and Growth Behavior of Cu/Al Intermetallic Compounds during Isothermal Aging

S. Itoh, H. Nishikawa, Min-Su Kim, 2014 .

Effect of isothermal aging on the growth behavior of Cu/Al intermetallic compounds

H. Nishikawa, Min-Su Kim, O. Mokhtari, 2014, 2014 International Conference on Electronics Packaging (ICEP).

Reliability of copper wire bonds on a novel over-pad metallization

S. Itoh, H. Nishikawa, F. Kawashiro, 2015 .

Reliability studies of Sn-Ag-Cu BGA solder joints on Ni/Cu/Au surface finish for SMAFTI packaging technology

K. Soejima, M. Kawano, M. Kawano, 2008, 2008 58th Electronic Components and Technology Conference.

Contributions of Nuclear Size and Shape, Nuclear Mass, and Nuclear Spin to Enrichment Factors of Zinc Isotopes in a Chemical Exchange Reaction by a Cryptand

T. Fujii, K. Nishizawa, Tadashi Yamamoto, 1998 .

Fan-Out Wafer-Level Packaging with highly flexible design capabilities

Hiroaki Kobayashi, Masaya Kawano, Takehiro Kimura, 2010, 3rd Electronics System Integration Technology Conference ESTC.