R. T. Mitchell

ULTRAHIGH-CAPACITY MICROMACHINED HEAT SPREADERS

G. P. Peterson, D. A. Benson, Melanie R. Tuck, 1998 .

Calculation and validation of thermomechanical stresses in flip chip BGA using the ATC4.2 test vehicle

J. N. Sweet, S. N. Burchett, D. W. Peterson, 1999, 1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299).

Liquid encapsulant stress variations as measured with the ATCO4 assembly test chip

J. N. Sweet, D. W. Peterson, J. A. Emerson, 1995, 1995 Proceedings. 45th Electronic Components and Technology Conference.

Micro-machined heat pipes in silicon MCM substrates

D. A. Benson, Melanie R. Tuck, D. Benson, 1996, Proceedings 1996 IEEE Multi-Chip Module Conference (Cat. No.96CH35893).