K. Prasad

High Aspect Ratio Through-Wafer Interconnect for Three Dimensional Integrated Circuits

N. Balasubramanian, S. C. Hwee, N. Balasubramanian, 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

Through-wafer interconnection by deep damascene process for MEMS and 3D wafer level packaging

N. Balasubramanian, Jiang Ning, C.S. Premachandran, 2005, 2005 7th Electronic Packaging Technology Conference.

Development of a novel deep silicon tapered via etch process for through-silicon interconnection in 3-D integrated systems

N. Balasubramanian, N. Balasubramanian, R. Nagarajan, 2006, 56th Electronic Components and Technology Conference 2006.