D.C. Katsis

A thermal, mechanical, and electrical study of voiding in the solder die-attach of power MOSFETs

J.D. vanWyk, D.C. Katsis, D. Katsis, 2006, IEEE Transactions on Components and Packaging Technologies.

Experimental measurement and simulation of thermal performance due to aging in power semiconductor devices

J.D. van Wyk, D.C. Katsis, 2002, Conference Record of the 2002 IEEE Industry Applications Conference. 37th IAS Annual Meeting (Cat. No.02CH37344).

Void induced thermal impedance in power semiconductor modules: some transient temperature effects

J.D. van Wyk, J. D. van Wyk, D.C. Katsis, 2001, Conference Record of the 2001 IEEE Industry Applications Conference. 36th IAS Annual Meeting (Cat. No.01CH37248).

A finite element modeling of dynamic hot spot effects in MOSFET dies due to voiding in the solder die-attach

D.C. Katsis, J.D. VanWyk, 2003, IEEE 34th Annual Conference on Power Electronics Specialist, 2003. PESC '03..

Development of an extreme temperature range silicon carbide power module for aerospace applications

D.C. Katsis, Yunqi Zheng, D. Katsis, 2008, 2008 IEEE Power Electronics Specialists Conference.