M. Topper
发表
H. Reichl,
O. Ehrmann,
K. Zoschke,
2005,
Proceedings Electronic Components and Technology, 2005. ECTC '05..
Oswin Ehrmann,
M. Topper,
K. Scherpinski,
2000,
ECTC 2000.
V. Pouget,
M. Topper,
A. Tetelin,
2005,
2005 IEEE Instrumentationand Measurement Technology Conference Proceedings.
H. Reichl,
O. Ehrmann,
M. Topper,
2005,
Proceedings Electronic Components and Technology, 2005. ECTC '05..
L. Rieth,
F. Solzbacher,
M. Klein,
2011,
2011 16th International Solid-State Sensors, Actuators and Microsystems Conference.
B. Wunderle,
M. Topper,
D. May,
2012,
18th International Workshop on THERMal INvestigation of ICs and Systems.
W. Heinrich,
M. Topper,
F. Lenk,
2005,
IEEE MTT-S International Microwave Symposium Digest, 2005..
O. Ehrmann,
M. Topper,
T. Fritzsch,
2013,
IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control.
H. Reichl,
O. Ehrmann,
K. Kaletta,
2007,
IEEE Transactions on Advanced Packaging.
M. Topper,
H. Oppermann,
J. Kleff,
2013,
2013 IEEE 63rd Electronic Components and Technology Conference.
H. Reichl,
P. Russer,
T. Mangold,
1998,
1998 URSI International Symposium on Signals, Systems, and Electronics. Conference Proceedings (Cat. No.98EX167).
H. Reichl,
O. Ehrmann,
K. Zoschke,
2004,
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).
M. Topper,
Martin Wilke,
Klaus Dieter Lang,
2012,
2012 IEEE 62nd Electronic Components and Technology Conference.
H. Reichl,
D. Manessis,
A. Ostmann,
2007,
2007 9th Electronics Packaging Technology Conference.
R. Aschenbrenner,
T. Braun,
M. Topper,
2016,
2016 IEEE 16th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF).
Herbert Reichl,
Oswin Ehrmann,
M. Topper,
1997,
Thirteenth Annual IEEE. Semiconductor Thermal Measurement and Management Symposium.
Herbert Reichl,
Oswin Ehrmann,
M. Topper,
1998,
Proceedings. 4th International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (Cat. No.98EX153).
H. Reichl,
H. Schroder,
L. Brusberg,
2009,
2009 11th Electronics Packaging Technology Conference.
R. Aschenbrenner,
T. Braun,
M. Topper,
2015,
2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC).
M. Topper,
R. Leib,
2004,
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).
H. Reichl,
F. Solzbacher,
T. Braun,
2006,
56th Electronic Components and Technology Conference 2006.
H. Reichl,
M. Topper,
K. Scherpinski,
2006,
56th Electronic Components and Technology Conference 2006.
H. Reichl,
M. Topper,
A. Achen,
2003,
53rd Electronic Components and Technology Conference, 2003. Proceedings..
O. Ehrmann,
K. Zoschke,
M. Topper,
2012,
2012 IEEE 62nd Electronic Components and Technology Conference.
H. Reichl,
O. Ehrmann,
M. Topper,
2000,
2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).
Herbert Reichl,
Oswin Ehrmann,
M. Topper,
1997,
Proceedings 3rd International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces.
Herbert Reichl,
Oswin Ehrmann,
M. Topper,
1999,
Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces (IEEE Cat. No.99TH8405).
H. Reichl,
O. Ehrmann,
M. Topper,
2006,
56th Electronic Components and Technology Conference 2006.