F. Liu

Recent advances in low CTE and high density system-on-a-package (SOP) substrate with thin film component integration

I.R. Abothu, S. Bhattacharya, P. Markondeya Raj, 2006, 56th Electronic Components and Technology Conference 2006.

Micro impact characterisation of solder joint for drop impact application

E.H. Wong, R. Rajoo, S.K.W. Seah, 2006, 56th Electronic Components and Technology Conference 2006.