S. Bernabé

发表

Thermal challenges for packaging integrated photonic devices

Lee Carroll, Peter O'Brien, Enrico Temporiti, 2016, 2016 6th Electronic System-Integration Technology Conference (ESTC).

Thermomechanical characterization of electronic components

P. Lipinski, M. Fendler, H. Ribot, 2010, 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE).

Towards self-alignment with copper pillars

O. Castany, S. Bernabé, P. Arguel, 2016, 2016 6th Electronic System-Integration Technology Conference (ESTC).

HIGH DATA RATE SILICON PHOTONIC - CMOS ELECTRONIC MODULES USING COPPER MICROBUMPS

S. Malhouitre, C. Kopp, S. Menezo, 2015 .

Low-loss 1310nm/1550nm Integrated Silicon Duplexer based on a Directional Coupler

B. Szelag, C. Kopp, D. Fowler, 2017, PHOTOPTICS 2017.

A Complete Si Photonics Platform Embedding Ultra-Low Loss Waveguides for O- and C-Band

J. Hartmann, B. Charbonnier, B. Szelag, 2020, Journal of Lightwave Technology.

Coupling and packaging issues of silicon based photonic integrated circuits

J. Fédéli, C. Kopp, S. Menezo, 2012, 2012 Asia Communications and Photonics Conference (ACP).

Epoxy free butt coupling between a lensed fiber and a silicon nanowire waveguide with an inverted taper configuration

H. Porte, B. Ben Bakir, S. Bernabé, 2011, 8th IEEE International Conference on Group IV Photonics.

POPSTAR: a Robust Modular Optical NoC Architecture for Chiplet-based 3D Integrated Systems

Christian Bernard, Yvain Thonnart, Pascal Vivet, 2020, 2020 Design, Automation & Test in Europe Conference & Exhibition (DATE).

Silicon photonics for terabit/s communication in data centers and exascale computers

B. Szelag, Quentin Wilmart, K. Hasharoni, 2020 .

Meeting the Electrical, Optical, and Thermal Design Challenges of Photonic-Packaging

Sylvie Menezo, Jun Su Lee, Lee Carroll, 2016, IEEE Journal of Selected Topics in Quantum Electronics.

Design and characterization of low-loss 2D grating couplers for silicon photonics integrated circuits

Cosimo Lacava, Riccardo Marchetti, Ilaria Cristiani, 2016, SPIE OPTO.

Dry-film technology as a standard process for passive optical alignment of Silicon Photonics Devices

Paul Philippe, Stephane Bernabe, Christophe Kopp, 2009, 2009 59th Electronic Components and Technology Conference.

Chip-to-chip optical interconnections between stacked self-aligned SOI photonic chips.

Julie Harduin, Jean-Marc Fédéli, Christophe Kopp, 2012, Optics express.

In-plane pigtailing of silicon photonics device using “semi-passive” strategies

Henri Porte, Stephane Bernabe, Jean-Marc Fedeli, 2012, 2012 4th Electronic System-Integration Technology Conference.

Silicon Photonic Circuits: On-CMOS Integration, Fiber Optical Coupling, and Packaging

R Orobtchouk, L Zimmermann, T Tekin, 2011, IEEE Journal of Selected Topics in Quantum Electronics.

A 10Gb/s Si-photonic transceiver with 150μW 120μs-lock-time digitally supervised analog microring wavelength stabilization for 1Tb/s/mm2 Die-to-Die Optical Networks

Yvain Thonnart, Charles Baudot, Sylvie Menezo, 2018, 2018 IEEE International Solid - State Circuits Conference - (ISSCC).

Analytical and FEM simulations of the thermal spreading effect in LED modules and IR thermography validation

H Ribot, H. Ribot, S. Bernabé, 2010, 2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE).

Reliability of fiber arrays

Christophe Roux, Frederic Laune, Herve Poujard, 2003, SPIE OPTO.

A fluxless bonding process using AuSn or Indium for a miniaturized hermetic package

Stephane Bernabe, Christophe Kopp, Adrien Gasse, 2009, 2009 59th Electronic Components and Technology Conference.

Advanced Si photonics platform for high-speed and energy-efficient optical transceivers for datacom

S. Brision, Corrado Sciancalepore, Bertrand Szelag, 2020, OPTO.

Photonic–Electronic Integration With Bonding

Emmanuel Augendre, Jochen Kraft, Stephane Bernabe, 2014, IEEE Journal of Selected Topics in Quantum Electronics.