Nicholas G. Koopman

Fluxless no-clean assembly of solder bumped flip chips

Nicholas G. Koopman, Sundeep Nangalia, V. Rogers, 1996, 1996 Proceedings 46th Electronic Components and Technology Conference.

Flip Chip Technology: A Method for Providing Known Good Die with High Density Interconnections

Glenn A. Rinne, Gretchen M. Adema, Iwona Turlik, 1994, Proceedings of the International Conference on Multichip Modules.