D.J. Pommerenke

Signal link-path characterization up to 20 GHz based on a stripline structure

Zhiping Yang, Wheling Cheng, S. Camerlo, 2006, 2006 IEEE International Symposium on Electromagnetic Compatibility, 2006. EMC 2006..

Reconstruction of Dispersive Dielectric Properties for PCB Substrates Using a Genetic Algorithm

A. Orlandi, G. Antonini, Zhiping Yang, 2008, IEEE Transactions on Electromagnetic Compatibility.