Peng Sun

High temperature aging study of intermetallic compound formation of Sn-3.5Ag and Sn-4.0Ag-0.5Cu solders on electroless Ni (P) metallization

Zhaonian Cheng, Dongkai Shangguan, J. Liu, 2006, 56th Electronic Components and Technology Conference 2006.

Study of interfacial reactions in Sn–3.5Ag–3.0Bi and Sn–8.0Zn–3.0Bi sandwich structure solder joint with Ni(P)/Cu metallization on Cu substrate

Zhaonian Cheng, Dongkai Shangguan, Xicheng Wei, 2007 .

Intermetallic compound formation in Sn-Co-Cu, Sn-Ag-Cu and eutectic Sn-Cu solder joints on electroless Ni(P) immersion au surface finish after reflow soldering

Zhaonian Cheng, Dongkai Shangguan, J. Liu, 2006, Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, 2006. HDP'06..