G. Klink
发表
D. Bonfert,
K. Bock,
P. Svasta,
2009,
2009 15th International Symposium for Design and Technology of Electronics Packages (SIITME).
Michael Feil,
C. Alder,
Christof Landesberger,
2003
.
C. Landesberger,
Rolf Aschenbrenner,
Gerhard Klink,
2001,
Proceedings International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces (IEEE Cat. No.01TH8562).
D. Bonfert,
K. Bock,
I. Bose,
2012,
2012 35th International Spring Seminar on Electronics Technology.
D. Bonfert,
K. Bock,
G. Klink,
2012,
2012 4th Electronic System-Integration Technology Conference.
D. Bonfert,
K. Bock,
P. Svasta,
2013,
Proceedings of the 36th International Spring Seminar on Electronics Technology.
D. Bonfert,
K. Bock,
P. Svasta,
2013,
2013 IEEE 19th International Symposium for Design and Technology in Electronic Packaging (SIITME).
Vincenzo Fiore,
Egidio Ragonese,
Giuseppe Palmisano,
2015,
IEEE Transactions on Circuits and Systems I: Regular Papers.
D. Bonfert,
K. Bock,
G. Klink,
2010,
33rd International Spring Seminar on Electronics Technology, ISSE 2010.
K. Bock,
E. Hammerl,
K. Bock,
2005,
Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics.
Karlheinz Bock,
Aman Russom,
Marcella Chiari,
2013,
Lab on a chip.
K. Bock,
K. Bock,
A. Drost,
2005,
Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005..
H. Gieser,
W. Hell,
C. Landesberger,
2014,
2014 IEEE 64th Electronic Components and Technology Conference (ECTC).
G. Palmisano,
E. Cantatore,
E. Ragonese,
2015,
IEEE Transactions on Circuits and Systems I: Regular Papers.