G. Carchon

发表

0-Level packaging techniques for flip-chip mounted MMICs

Steven Brebels, Anne Jourdain, W. De Raedt, 2001 .

RF-MEMS technology platform for agile mobile and satellite communications

P. Soussan, W. De Raedt, S. Stoukatch, 2006, 2006 European Microwave Conference.

Class 3 HBM and class M4 MM ESD protected 5.5 GHz LNA in 90 nm RFCMOS using above-IC inductor

P. Soussan, P. Wambacq, G. Groeseneken, 2005, 2005 Electrical Overstress/Electrostatic Discharge Symposium.

Enabling Technologies for 60 GHz Communications: Front‐End Friendly Air Interface Design, Full CMOS Integration and System‐in‐a‐Package

Steven Brebels, Andre Bourdoux, Piet Wambacq, 2009 .

Wafer level packaging technology for low-loss on-chip transmission lines and inductors

Eric Beyne, W. De Raedt, G. Carchon, 2003 .

Integrated passive design library for multilayer PCB

Xiao Sun, S. Brebels, K. Vaesen, 2006, 56th Electronic Components and Technology Conference 2006.

Use of RF MEMS and micromachined parts to realize highly integrated V band active feed for satellite antennas

J.L. Cazaux, C. Drevon, O. Vendier, 2006, 2006 European Microwave Conference.

A Design-Oriented Scaleable MMIC Spiral Inductor Model

S. Vandenberghe, W. De Raedt, D. Schreurs, 1998, 1998 28th European Microwave Conference.

Optimal Design Parameters for High Performant InP HEMT Frequency Doublers

S. Vandenberghe, W. De Raedt, D. Schreurs, 1998, 1998 28th European Microwave Conference.

Novel approach for a design-oriented measurement-based fully scalable coplanar waveguide transmission line model

Bart Nauwelaers, G. Carchon, W. De Raedt, 2001 .

Identifying error-box parameters from the twelve-term vector network analyzer error model

S. Vandenberghe, W. De Raedt, D. Schreurs, 2002, 60th ARFTG Conference Digest, Fall 2002..

MEMS-IC integration for RF and millimeterwave applications

R. Plana, W. De Raedt, D. Dubuc, 2005, 2005 European Microwave Conference.

High-Q Inductors for Realization of Low Insertion Loss Baluns and Couplers Integrated in Thin Film Multilayer MCM-D Technology for Wireless Applications

E. Beyne, S. Brebels, W. De Raedt, 2000, 2000 30th European Microwave Conference.

Intelligent hyper-spectral mm-wave illumination techniques for feature extraction of hidden objects in indoor security applications: a fusion of photonics, electronics and electromagnetism (invited paper)

Dominique Schreurs, Ann Franchois, Jean-Pierre Raskin, 2008 .

A direct Ku-band linear subharmonically pumped BPSK and I/Q vector modulator in multi-layer thin-film MCM-D

W. De Raedt, G. Carchon, D. Schreurs, 2001, 2001 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium (IEEE Cat. No.01CH37173).

Power and noise limitations of active circulators

G. Carchon, B. Nanwelaers, G. Carchon, 2000 .

Integrated Wilkinson Power Dividers in C-, Ku- and Ka-Band in Multi-Layer Thin-Film MCM-D

S. Brebels, W. De Raedt, P. Pieters, 2000, 2000 30th European Microwave Conference.

Easy and accurate empirical transistor model parameter estimation from vectorial large-signal measurements

S. Vandenberghe, D. Schreurs, J. Verspecht, 1999, 1999 IEEE MTT-S International Microwave Symposium Digest (Cat. No.99CH36282).

Experimental analysis of above-IC inductor performance with different patterned ground shield configurations and dummy metals

W. De Raedt, G. Carchon, X. Sun, 2006, 2006 European Microwave Conference.

RF Technologies and Systems

Hendrikus Tilmans, Eric Beyne, G. Carchon, 2009 .

High-Q on-chip inductors using thin-film wafer level packaging technology demonstrated on a 90 nm RF-CMOS 5 GHz VCO

P. Soussan, S. Decoutere, W. De Raedt, 2005, 2005 European Microwave Conference.

Optimization of 0-level packaging for RF-MEMS devices

A. Jourdain, G. Carchon, X. Rottenberg, 2003, TRANSDUCERS '03. 12th International Conference on Solid-State Sensors, Actuators and Microsystems. Digest of Technical Papers (Cat. No.03TH8664).

Large-signal state-space model for Ge-based MHEMTs: construction and validation by an amplifier in multilayer thin-film technology

D. Schreurs, G. Borghs, R. Vandersmissen, 2003, Conference, 2003. Fall 2003. 62nd ARFTG Microwave Measurements.

Multi-layer thin-film MCM-D for the realization of Q- and V-band functions

S. Brebels, W. De Raedt, O. Vendier, 2003, IEEE MTT-S International Microwave Symposium Digest, 2003.

Perspective of RF design in future planar and FinFET CMOS

P. Wambacq, B. Parvais, A. Mercha, 2008, 2008 IEEE Radio Frequency Integrated Circuits Symposium.

Compact (<0.5mm2) K-band metamaterial bandpass filter in MCM-D technology

Ferran Martin, Jordi Bonache, W. De Raedt, 2007 .

A 5-25 GHz high linearity, low-noise CMOS amplifier

H. Jacobsson, A. Mercha, G. Carchon, 2006, 2006 Proceedings of the 32nd European Solid-State Circuits Conference.

A 5.8 GHz 1.7 dB NF fully integrated differential low noise amplifier in CMOS

H. Jacobsson, Mingquan Bao, H. Sjoland, 2006, 2006 Asia-Pacific Microwave Conference.

Thin-film as enabling passive integration technology for RF SoC and SiP

E. Beyne, D. Linten, G. Carchon, 2005, ISSCC. 2005 IEEE International Digest of Technical Papers. Solid-State Circuits Conference, 2005..

A low-cost 90nm RF-CMOS platform for record RF circuit performance

P. Soussan, P. Wambacq, A. Mercha, 2005, Digest of Technical Papers. 2005 Symposium on VLSI Technology, 2005..

High-Q RF inductors on standard silicon realized using wafer-level packaging techniques

E. Beyne, S. Decoutere, W. De Raedt, 2003, IEEE MTT-S International Microwave Symposium Digest, 2003.

Advanced non-linear InP HEMT model parameter estimation from vectorial large-signal measurements

S. Vandenberghe, D. Schreurs, J. Verspecht, 1999, Conference Proceedings. Eleventh International Conference on Indium Phosphide and Related Materials (IPRM'99) (Cat. No.99CH36362).

Wafer-level packaging technology for extended global wiring and inductors

E. Beyne, S. Decoutere, W. De Raedt, 2003, ESSDERC '03. 33rd Conference on European Solid-State Device Research, 2003..

Analysis of high-Q on-chip inductors realized by wafer-level packaging techniques

E. Beyne, W. De Raedt, G. Carchon, 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

Microstrip thin-film MCM-D technology on high-resistivity silicon with integrated through-substrate vias

P. Soussan, W. De Raedt, B. Nauwelaers, 2007, 2007 European Microwave Integrated Circuit Conference.

Low loss coupled line filters with transmission zeros in multi-layer thin film MCM-D technology

W. De Raedt, B. Nauwelaers, G. Carchon, 2004, 2004 IEEE MTT-S International Microwave Symposium Digest (IEEE Cat. No.04CH37535).

24 GHz LNA in 90nm RF-CMOS with high-Q above-IC inductors

P. Soussan, S. Decoutere, W. De Raedt, 2005, Proceedings of the 31st European Solid-State Circuits Conference, 2005. ESSCIRC 2005..

Integration of 0/1-Level Packaged RF-MEMS Devices on MCM-D at Millimeter-Wave Frequencies

J. Schoebel, A. Jourdain, O. Vendier, 2005, IEEE Transactions on Advanced Packaging.

Ultra-Miniaturized Integrated Cavities on High-Resistivity Silicon Thin-Film MCM-D Technology

W. De Raedt, B. Nauwelaers, G. Carchon, 2008, 2008 IEEE Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems.

Low Phase Noise sub-1 V Supply 12 and 18 GHz VCOs in 90 nm CMOS

H. Jacobsson, A. Mercha, Mingquan Bao, 2006, 2006 IEEE MTT-S International Microwave Symposium Digest.

A 20 GHz sub-1V low noise amplifier and a resistive mixer in 90 nm CMOS technology

H. Jacobsson, A. Mercha, G. Carchon, 2005, 2005 Asia-Pacific Microwave Conference Proceedings.

Accurate measurement and characterization up to 50 GHz of CPW-based integrated passives in microwave MCM-D

S. Brebels, W. De Raedt, G. Carchon, 2000, 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).

Characteristic Impedance Extraction Using Calibration Comparison

S. Vandenberghe, D. Schreurs, B. Nauwelaers, 2001, 57th ARFTG Conference Digest.

60 GHz Si micromachined cavity resonator on MCM-D

W. De Raedt, B. Nauwelaers, A. Jourdain, 2006, Digest of Papers. 2006 Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems.

Design and characterization of CPW feedthroughs in multi-layer thin-film MCM-D

S. Brebels, W. De Raedt, B. Nauwelaers, 2000, RAWCON 2000. 2000 IEEE Radio and Wireless Conference (Cat. No.00EX404).

High-resistivity silicon surface passivation for the thin-film MCM-D technology

P. Soussan, W. De Raedt, B. Nauwelaers, 2006, Digest of Papers. 2006 Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems.

An optimized model of skin effect for on-chip spiral inductors

W. De Raedt, G. Carchon, X. Sun, 2004, 2004 IEE Radio Frequency Integrated Circuits (RFIC) Systems. Digest of Papers.

High-Q RF inductors on low resistivity silicon through wafer post-processing

Eric Beyne, W. De Raedt, G. Carchon, 2002 .

A 15 GHz and a 20 GHz low noise amplifier in 90 nm RF-CMOS

H. Jacobsson, Mingquan Bao, H. Sjoland, 2006, Digest of Papers. 2006 Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems.

Thin-film MCM-D technology with through-substrate vias for the integration of 3D SiP modules

W. De Raedt, B. Nauwelaers, G. Carchon, 2008, 2008 58th Electronic Components and Technology Conference.

Multilayer thin-film MCM-D for the integration of high-performance RF and microwave circuits

Steven Brebels, Eric Beyne, Bart Nauwelaers, 2001 .

Extending on-die wiring hierarchy with wafer level packaging concepts

E. Beyne, S. Brebels, W. De Raedt, 2004, Proceedings of the IEEE 2004 International Interconnect Technology Conference (IEEE Cat. No.04TH8729).