Cheng Chen

Reliability of Ultra-Thin Embedded Silicon Fan-Out (eSiFO) Package Directly Assembled on PCB for Mobile Applications

Lixi Wan, Daquan Yu, Zhiyi Xiao, 2018, 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).

Experimental evaluation of a compact two-phase cooling system for high heat flux electronic packages

Weiqi Wang, Liqiang Cao, J. Ferreira, 2019, Applied Thermal Engineering.

Warpage Prediction and Optimization for Embedded Silicon Fan-Out Wafer-Level Packaging Based on an Extended Theoretical Model

Cheng Chen, Lixi Wan, Teng Wang, 2019, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Warpage simulation and experimental verification for 320 mm × 320 mm panel level fan-out packaging based on die-first process

Jun Li, Liqiang Cao, Cheng Chen, 2018, Microelectron. Reliab..

Thermo-mechanical reliability analysis of a RF SiP module based on LTCC substrate

Fengman Liu, Qian She, Liqiang Cao, 2017, Microelectron. Reliab..

Uniformity improvement of deep silicon cavities fabricated by plasma etching with 12-inch wafer level

Daquan Yu, Zihan Dong, Yuanwei Lin, 2019, Journal of Micromechanics and Microengineering.