Teng Wang

Reliability of Ultra-Thin Embedded Silicon Fan-Out (eSiFO) Package Directly Assembled on PCB for Mobile Applications

Lixi Wan, Daquan Yu, Zhiyi Xiao, 2018, 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).

Study of Three-Dimensional Small Chip Stacking Using Low Cost Wafer-Level Micro-bump/B-Stage Adhesive Film Hybrid Bonding and Via-Last TSVs

Daquan Yu, N. Zhao, Haitao Ma, 2018, Journal of Electronic Materials.

Warpage Prediction and Optimization for Embedded Silicon Fan-Out Wafer-Level Packaging Based on an Extended Theoretical Model

Cheng Chen, Lixi Wan, Teng Wang, 2019, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Optimization and Characterization of Low-Temperature Wafer-Level Hybrid Bonding Using Photopatternable Dry Film Adhesive and Symmetric Micro Cu Pillar Solder Bumps

Daquan Yu, N. Zhao, Haitao Ma, 2018, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Failure Analysis Work Flow for Electrical Shorts in Triple Stacked 3D TSV Daisy Chains

I. De Wolf, J. Gaudestad, Antonio Orozco, 2015 .

Embedded Silicon Fan-Out (eSiFO): A Promising Wafer Level Packaging Technology for Multi-chip and 3D System Integration

Daquan Yu, Zhiyi Xiao, Shuying Ma, 2018, 2018 IEEE 68th Electronic Components and Technology Conference (ECTC).