M. Osterman
发表
Haiyu Qi,
M. Osterman,
M. Pecht,
2008,
IEEE Transactions on Advanced Packaging.
M. Pecht,
Haiyu Qi,
M. Osterman,
2004,
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).
M. Osterman,
D. Humphrey,
R. Guha,
2002
.
Haiyu Qi,
M. Osterman,
M. Pecht,
2009,
IEEE Transactions on Components and Packaging Technologies.
M. Pecht,
Yunhan Huang,
M. Osterman,
2012,
2012 IEEE 62nd Electronic Components and Technology Conference.
M. Pecht,
T. Shibutani,
M. Osterman,
2009,
IEEE Transactions on Components and Packaging Technologies.
M. Osterman,
P. McCluskey,
R. Jain,
1998,
1998 Fourth International High Temperature Electronics Conference. HITEC (Cat. No.98EX145).
Haiyu Qi,
M. Osterman,
M. Pecht,
2007,
IEEE Transactions on Components and Packaging Technologies.
M. Pecht,
M. Osterman,
Haiyu Qi,
2009,
IEEE Transactions on Electronics Packaging Manufacturing.
M. Pecht,
Yunhan Huang,
M. Osterman,
2012,
IEEE Transactions on Device and Materials Reliability.
M. Pecht,
M. Osterman,
V. Challa,
2008,
2008 58th Electronic Components and Technology Conference.
M. Osterman,
M. Pecht,
S.W.R. Lee,
2006,
2006 International Conference on Electronic Materials and Packaging.
C. A. Rust,
M. Osterman,
T. Stadterman,
1995,
Proceedings of the Eleventh Biennial University/Government/ Industry Microelectronics Symposium.
M. Pecht,
M. Osterman,
S. Mathew,
2012,
2012 IEEE Conference on Prognostics and Health Management.
M.G. Pecht,
Haiyu Qi,
M. Osterman,
2008,
IEEE Transactions on Components and Packaging Technologies.
S. Ganesan,
Haiyu Qi,
M. Osterman,
2007,
2007 Proceedings 57th Electronic Components and Technology Conference.
M. Osterman,
M. Osterman,
D. Pinsky,
2004,
IEEE Transactions on Components and Packaging Technologies.
M. Osterman,
M. Pecht,
Fubin Song,
2009,
IEEE Transactions on Components and Packaging Technologies.
M. Osterman,
M. Pecht,
M. Pecht,
2009,
IEEE Transactions on Components and Packaging Technologies.
M. Osterman,
A. Dasgupta,
B. Han,
2006,
56th Electronic Components and Technology Conference 2006.
M. Osterman,
- A.Dasgupta,
2002
.
M. Osterman,
M. Pecht,
M. Pecht,
2008,
IEEE Transactions on Device and Materials Reliability.
A. Bar-Cohen,
M. Osterman,
M. Pecht,
2009,
IEEE Transactions on Device and Materials Reliability.
M. Osterman,
A. Dasgupta,
S. Yoon,
2005,
Proceedings Electronic Components and Technology, 2005. ECTC '05..
M. Osterman,
M. Pecht,
M. Pecht,
2012,
2012 13th International Conference on Electronic Packaging Technology & High Density Packaging.
Qiang Yu,
M. Osterman,
M. Pecht,
2012,
Proceedings of the IEEE 2012 Prognostics and System Health Management Conference (PHM-2012 Beijing).
Haiyu Qi,
M. Osterman,
M. Pecht,
2004,
Proceedings of 2004 International Conference on the Business of Electronic Product Reliability and Liability (IEEE Cat. No.04EX809).
M. Osterman,
M. Pecht,
M. Pecht,
2006,
IEEE Transactions on Electronics Packaging Manufacturing.
Qiang Yu,
T. Shibutani,
M. Osterman,
2007,
2007 International Symposium on High Density packaging and Microsystem Integration.
M. Osterman,
M. Pecht,
M. Pecht,
2007,
IEEE Transactions on Electronics Packaging Manufacturing.