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S. P. Kowalczyk, Young-Ho Kim, G. Walker, 1988 .

Adhesion and interface investigation of polyimide on metals

C. Feger, S. P. Kowalczyk, Young-Ho Kim, 1988 .

Adhesion and interface studies between copper and polyimide

J. Park, Y.-H. Kim, George F. Walker, 1987 .

Adhesion of poly(arylene ether benzimidazole) to copper and polyimides

S. Cohen, Kang-Wook Lee, M. Ree, 1996 .

Formation of polyimide- Cu complexes: improvement of direct Cu-on-PI and PI-on-Cu adhesion

Kang-Wook Lee, A. Viehbeck, G. Walker, 1995 .

Cu passivation: A method of inhibiting copper‐polyamic acid interactions

D. Shih, Chih-Chao Yang, G. Walker, 1991 .

Enabling technologies for wafer-level bonding of 3D MEMS and integrated circuit structures

Anna W. Topol, A.W. Topol, K. Guarini, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).