X. Chauffleur

Characterization and modelling of ageing failures on power MOSFET devices

Marc Legros, Patrick Tounsi, Benjamin Khong, 2007, Microelectron. Reliab..

Innovative Methodology for Predictive Reliability of Intelligent Power Devices Using Extreme Electro-thermal Fatigue

Philippe Dupuy, Marc Legros, Patrick Tounsi, 2005, Microelectron. Reliab..

New method for electrothermal simulations: HDTMOS in automotive applications

X. Chauffleur, P. Tounsi, J.M. Dorkel, 2004, Twentieth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (IEEE Cat. No.04CH37545).

Virtual reliability assessment of integrated power switches based on multi-domain simulation approach

Alberto Castellazzi, Michel Mermet-Guyennet, Mauro Ciappa, 2007, Microelectron. Reliab..

Modeling Thermal Laser Stimulation

Romain Desplats, Philippe Perdu, X. Chauffleur, 2001, Microelectron. Reliab..

Smart 3-D Finite-Element Modeling for the Design of Ultra-Low On-Resistance MOSFET

X. Chauffleur, A. Deram, P. Tounsi, 2007, IEEE Transactions on Advanced Packaging.

A dedicated micromachining technology for high-aspect-ratio millimetre-wave circuits

Patrick Pons, Robert Plana, G. Blasquez, 1998 .

Non linear 3D electrothermal investigation on power MOS chips

X. Chauffleur, P. Tounsi, J.M. Dorkel, 2004, Bipolar/BiCMOS Circuits and Technology, 2004. Proceedings of the 2004 Meeting.

Intrinsic thermal behaviour of capacitive pressure sensors: mechanisms and minimisation

Patrick Pons, G. Blasquez, X. Chauffleur, 2000 .

Effect of membrane shape on mechanical behavior of RF switches

David Dubuc, Ali Boukabache, Patrick Pons, 2004 .

Influence of the bonding conditions on the response of capacitive pressure sensors

Patrick Pons, G. Blasquez, X. Chauffleur, 1995 .