M. Kobrinsky
发表
E.R. Deutsch,
S. Senturia,
S.D. Senturia,
2000,
Journal of Microelectromechanical Systems.
S. Ramanathan,
M. Harmes,
S. Ramanathan,
2006,
IEEE Electron Device Letters.
C. Thompson,
M. Kobrinsky,
2000
.
J. Bielefeld,
S. King,
H. Hiramatsu,
2010,
2010 IEEE International Interconnect Technology Conference.
M. Kobrinsky,
2004
.
Narendra V. Lakamraju,
J. Bielefeld,
R. Kasim,
2015,
2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM).
Narendra V. Lakamraju,
Kevin L. Lin,
K. Singh,
2014,
IEEE International Interconnect Technology Conference.
Jimmy Liu,
M. Kobrinsky,
M. Kuhn,
2013
.
B. Corbett,
P. Chang,
J. O'Callaghan,
2014,
OFC 2014.
C. Thompson,
M. Kobrinsky,
1999
.
J. Abriata,
M. Kobrinsky,
J. Bolcich,
1996
.
Carl V. Thompson,
Mauro J. Kobrinsky,
C. Thompson,
1998
.
C. Thompson,
M. Kobrinsky,
2002
.
E. Arzt,
G. Dehm,
M. Kobrinsky,
2001
.
D. Jiao,
S. Chakravarty,
M.J. Kobrinsky,
2005,
IEEE Transactions on Advanced Packaging.
M.J. Kobrinsky,
B.C. Barnett,
Kuan-Neng Chen,
2004,
IEEE Transactions on Electron Devices.
Carl V. Thompson,
Mauro J. Kobrinsky,
C. Thompson,
2001
.
G. Dewey,
J. Kavalieros,
M. Metz,
2021,
2021 IEEE International Electron Devices Meeting (IEDM).
R. Krishnamurthy,
M. Reshotko,
H. Kaul,
2020,
International Electron Devices Meeting.