G. Schwartz

发表

Reactive ion etching induced corrosion of Al and Al‐Cu films

Wen‐Yaung Lee, Jerome Michael Eldridge, J. M. Eldridge, 1981 .

Distribution of Material Sputtered from a Disk Electrode

R. Jones, L. Maissel, G. Schwartz, 1969 .

Reactive Ion Etching of Copper Films

G. Schwartz, P. M. Schaible, 1983 .

Handbook of Semiconductor Interconnection Technology, Second Edition

K. Srikrishnan, G. Schwartz, 2006 .

The Effects of Arsenic Doping in Reactive Ion Etching of Silicon in Chlorinated Plasmas

G. Schwartz, P. M. Schaible, 1983 .

Competitive Mechanisms in Reactive Ion Etching in a CF 4 Plasma

L. Rothman, G. Schwartz, T. J. Schopen, 1979 .

An Anodic Process for Forming Planar Interconnection Metallization for Multilevel LSI

G. Schwartz, V. Platter, 1975 .

Mechanism of silicon etching by a CF4 plasma

J. Mauer, J. S. Logan, G. Schwartz, 1978 .

Plasma‐Enhanced Chemical Vapor Deposition of Silicon Dioxide Films Using Tetraethoxysilane and Oxygen: Characterization and Properties of Films

R. Carruthers, W. Patrick, Kurt C. Olsen, 1992 .

Gap‐Fill with PECVD SiO2 Using Deposition/Sputter Etch Cycles

G. Schwartz, Paul M. Johns, 1992 .

Proceedings of the eighth symposium on plasma processing

G. S. Mathad, R. Gottscho, G. Schwartz, 1990 .

Argon content of SiO 2 , films deposited by RF sputtering in argon

R. Jones, G. Schwartz, 1970 .

Reactive ion etching of silicon

G. Schwartz, P. M. Schaible, 1979 .

Summary Abstract: Reactive ion etching induced corrosion of Al and Al–Cu films

J. M. Eldridge, G. Schwartz, M. Chen, 1981 .

Preferential lateral chemical etching in reactive ion etching of aluminum and aluminum alloys

G. Schwartz, P. M. Schaible, 1979 .

Abstract: Mechanisms of silicon etching by CF4 plasma

J. Mauer, J. S. Logan, G. Schwartz, 1978 .

Selective Reactive Ion Etching of TiW

G. Schwartz, P. M. Schaible, 1985 .