V. Sundaram
发表
Fuhan Liu,
R.R. Tummala,
V. Sundaram,
2004,
Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04).
V. Sundaram,
S. Bhattacharya,
F. Ayazi,
2002,
2002 IEEE MTT-S International Microwave Symposium Digest (Cat. No.02CH37278).
V. Sundaram,
S. Dalmia,
M. Swaminathan,
2004,
34th European Microwave Conference, 2004..
V. Sundaram,
S. Dalmia,
V. Govind,
2006,
2006 IEEE MTT-S International Microwave Symposium Digest.
M. Tentzeris,
Fuhan Liu,
V. Sundaram,
2004,
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).
J. Papapolymerou,
V. Sundaram,
W. T. Khan,
2015,
2015 European Microwave Conference (EuMC).
V. Sundaram,
M. Swaminathan,
R. Tummala,
2007,
IEEE Transactions on Advanced Packaging.
Fuhan Liu,
V. Sundaram,
R. Tummala,
2012,
2012 IEEE 62nd Electronic Components and Technology Conference.
J. Papapolymerou,
V. Sundaram,
M. Swaminathan,
2011,
IEEE Microwave Magazine.
M. Tentzeris,
V. Sundaram,
M. Maeng,
2002,
2002 IEEE MTT-S International Microwave Symposium Digest (Cat. No.02CH37278).
V. Sundaram,
R. Tummala,
M. Swaminathan,
2008,
2008 58th Electronic Components and Technology Conference.
V. Sundaram,
S. Dalmia,
P. Monajemi,
2006,
2006 European Microwave Conference.
V. Sundaram,
M. Swaminathan,
R. Tummala,
2007,
2007 Proceedings 57th Electronic Components and Technology Conference.
R.R. Tummala,
V. Sundaram,
D. Guidotti,
2004,
IEEE Transactions on Advanced Packaging.
V. Sundaram,
S. Dalmia,
Sung-Hwan Min,
2007,
2007 Proceedings 57th Electronic Components and Technology Conference.
V. Sundaram,
S. Dalmia,
M. Swaminathan,
2004,
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).
R.R. Tummala,
V. Sundaram,
P. Markondeya Raj,
2004,
Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04).
V. Sundaram,
R. Tummala,
M. R. Pulugurtha,
2013,
IEEE Transactions on Components, Packaging and Manufacturing Technology.
V. Sundaram,
P.M. Raj,
Lixi Wan,
2005,
Proceedings Electronic Components and Technology, 2005. ECTC '05..
V. Sundaram,
M. Swaminathan,
S. Dalmia,
2004,
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).
M. Tentzeris,
V. Sundaram,
D. Guidotti,
2004,
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).
R.R. Tummala,
V. Sundaram,
D. Guidotti,
2004,
IEEE Transactions on Advanced Packaging.
V. Sundaram,
S. Dalmia,
M. Swaminathan,
2006,
IEEE Transactions on Advanced Packaging.
V. Sundaram,
P. Venugopalan,
S. Gollakota,
1995
.
Fuhan Liu,
V. Sundaram,
R. Tummala,
2005,
2005 6th International Conference on Electronic Packaging Technology.
R.R. Tummala,
V. Sundaram,
S. Bhattacharya,
2002,
2002 IEEE MTT-S International Microwave Symposium Digest (Cat. No.02CH37278).
R.R. Tummala,
V. Sundaram,
Y. Fukuoka,
2004,
IEEE Transactions on Advanced Packaging.
Fuhan Liu,
V. Sundaram,
R. Tummala,
2012,
2012 IEEE 62nd Electronic Components and Technology Conference.