D. Guidotti

发表

Multifunctional integrated substrate technology for high density SOP packaging

Fuhan Liu, R.R. Tummala, V. Sundaram, 2004, Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04).

System-on-a-package (SOP) substrate and module with digital, RF and optical integration

M. Tentzeris, Fuhan Liu, V. Sundaram, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

Millimeter wave interchip communication

Liqiang Cao, D. Guidotti, Qian Wang, 2012, Proceedings of 2012 5th Global Symposium on Millimeter-Waves.

Low latency high throughput memory-processor interface

Liqiang Cao, D. Guidotti, Qian Wang, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

A low-power wide-band 20GHz VCO in 65nm CMOS

D. Guidotti, Shengxi Diao, Fujiang Lin, 2012, Proceedings of 2012 5th Global Symposium on Millimeter-Waves.

Chip-to-chip optoelectronics SOP on organic boards or packages

R.R. Tummala, V. Sundaram, D. Guidotti, 2004, IEEE Transactions on Advanced Packaging.

System-on-a-package (SOP) module development for a digital, RF and optical mixed signal integrated system

M. Tentzeris, V. Sundaram, D. Guidotti, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

Optically synchronized MIMO interconnects for 3D HPC memory access systems using radio-over-fiber technology

Ting Wang, Gee-Kung Chang, Shu-Hao Fan, 2012, OFC/NFOEC.

The SOP for miniaturized, mixed-signal computing, communication, and consumer systems of the next decade

R.R. Tummala, V. Sundaram, D. Guidotti, 2004, IEEE Transactions on Advanced Packaging.

Flexible Polymer Optical Bus for Inter-Board Optical Interconnects

Gee-Kung Chang, D. Guidotti, Lixi Wan, 2007, LEOS 2007 - IEEE Lasers and Electro-Optics Society Annual Meeting Conference Proceedings.

A digital-optical system-on-package module architecture for high performance multiprocessors

Gee-Kung Chang, Jianjun Yu, Fuhan Liu, 2004, The 17th Annual Meeting of the IEEELasers and Electro-Optics Society, 2004. LEOS 2004..

Low latency compute node architecture cooled by a two phase fluid flow

D. Guidotti, Qidong Wang, Lixi Wan, 2012, 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging.

Design, fabrication, and reliability testing of embedded optical interconnects on package

Gee-Kung Chang, Fuhan Liu, D. Guidotti, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

Hybrid Integration of End-to-End Optical Interconnects on Printed Circuit Boards

Gee-Kung Chang, Jianjun Yu, Fuhan Liu, 2007, IEEE Transactions on Components and Packaging Technologies.

Board-level optical-to-electrical signal distribution at 10 gb/s

Gee-Kung Chang, D. Guidotti, Lixi Wan, 2006, IEEE Photonics Technology Letters.

An Anchor-Board-Based Flexible Optoelectronic Harness for Off-Chip Optical Interconnects

Gee-Kung Chang, D. Guidotti, Yin-Jung Chang, 2008, IEEE Photonics Technology Letters.

Accurate electrical simulation and design optimization for silicon interposer considering the MOS effect and eddy currents in the silicon substrate

Chongshen Song, Liqiang Cao, D. Guidotti, 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.

Material and process challenges in embedding polymeric waveguides and detectors in system on package (SOP)

Fuhan Liu, D. Guidotti, Yin-Jung Chang, 2004, 9th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces (IEEE Cat. No.04TH8742). 2004 Proceedings..

Edge viewing photodetectors for strictly in-plane lightwave circuit integration and flexible optical interconnects

Gee-Kung Chang, Jianjun Yu, D. Guidotti, 2006, 56th Electronic Components and Technology Conference 2006.