P.M. Raj

Multifunctional integrated substrate technology for high density SOP packaging

Fuhan Liu, R.R. Tummala, V. Sundaram, 2004, Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04).

Design, modeling and characterization of embedded capacitor networks for mid-frequency decoupling in semiconductor systems

P.M. Raj, S. Bhattacharya, D. Balaraman, 2005, 2005 International Symposium on Electromagnetic Compatibility, 2005. EMC 2005..

Packaging of multi-core microprocessors: tradeoffs and potential solutions

V. Sundaram, P.M. Raj, Lixi Wan, 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

The SOP for miniaturized, mixed-signal computing, communication, and consumer systems of the next decade

R.R. Tummala, V. Sundaram, D. Guidotti, 2004, IEEE Transactions on Advanced Packaging.