D. Balaraman

发表

Multifunctional integrated substrate technology for high density SOP packaging

Fuhan Liu, R.R. Tummala, V. Sundaram, 2004, Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04).

Design, modeling and characterization of embedded capacitor networks for mid-frequency decoupling in semiconductor systems

P.M. Raj, S. Bhattacharya, D. Balaraman, 2005, 2005 International Symposium on Electromagnetic Compatibility, 2005. EMC 2005..

Chip-to-chip optoelectronics SOP on organic boards or packages

R.R. Tummala, V. Sundaram, D. Guidotti, 2004, IEEE Transactions on Advanced Packaging.

Design, fabrication, and reliability assessment of embedded resistors and capacitors on multilayered organic substrates

P. Viswanadham, I.R. Abothu, S. Bhattacharya, 2005, Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005..

Processing of polymer-ceramic nanocomposites for system-on-package applications

D. Balaraman, P. Markondeya Raj, S.K. Bhattacharya, 2001, 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220).

Simultaneous switching noise suppression using hydrothermal barium titanate thin film capacitors

I.R. Abothu, S. Bhattacharya, D. Balaraman, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

Processing and Dielectric Properties of Nanocomposite Thin Film “Supercapacitors” for High-Frequency Embedded Decoupling

I.R. Abothu, D. Balaraman, Lixi Wan, 2007, IEEE Transactions on Components and Packaging Technologies.

Colloidal processing of polymer ceramic nanocomposites for integral capacitors

Rao Tummala, D. Balaraman, P. M. Raj, 2001 .

Development of high-k embedded capacitors on printed wiring board using sol-gel and foil-transfer processes

I.R. Abothu, S. Bhattacharya, D. Balaraman, 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

Embedded decoupling capacitor performance in high speed circuits

I.R. Abothu, D. Balaraman, Lixi Wan, 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..

Novel hydrothermal processing (<100/spl deg/C) of ceramic-polymer composites for integral capacitor applications

D. Balaraman, P. Markondeya Raj, R. Tummala, 2002, 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).

BaTiO3 Films by Low-Temperature Hydrothermal Techniques for Next Generation Packaging Applications

Pulugurtha Markondeya Raj, Rao Tummala, D. Balaraman, 2004 .

Hydrothermal Barium Titanate Thin-Film Characteristics and their Suitability as Decoupling Capacitors

Rao Tummala, D. Balaraman, Baik-Woo Lee, 2010 .

Integration and high-frequency characterization of PWB-compatible pure barium titanate films synthesized by modified hydrothermal techniques (< 100/spl deg/C)

Pulugurtha Markondeya Raj, Rao Tummala, D. Balaraman, 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

Low-cost low actuation voltage copper RF MEMS switches

D. Balaraman, F. Ayazi, J. Papapolymerou, 2002, 2002 IEEE MTT-S International Microwave Symposium Digest (Cat. No.02CH37278).