N. Su

Development of thin film dielectric embedded 3D stacked package

Siong Chiew Ong, S. W. Ho, V. S. Rao, 2009, 2009 11th Electronics Packaging Technology Conference.

Thermo-mechanical actuator-based miniature tagging module for localization in capsule endoscopy

Germaine Hoe Yen Yi, K. Vaidyanathan, J. Chandrappan, 2011 .

Millimeter wave dielectric characterization & demonstration of High-Q passives using a low loss thin film material

N. Su, L. Ying, D. Wee, 2009, 2009 11th Electronics Packaging Technology Conference.

Development of 3-D silicon die stacked package using flip chip technology with micro bump interconnects

John H. Lau, Ying Ying Lim, K. Y. Au, 2009, 2009 59th Electronic Components and Technology Conference.

3D packaging with through ilicon via (TSV) for electrical and fluidic interconnections

John H. Lau, Nandar Su, Vaidyanathan Kripesh, 2009, 2009 59th Electronic Components and Technology Conference.

Demonstration of high quality and low loss millimeter wave passives on embedded wafer level packaging platform (EMWLP)

John H. Lau, Teck Guan Lim, Ying Ying Lim, 2009, 2009 59th Electronic Components and Technology Conference.

High Quality and Low Loss Millimeter Wave Passives Demonstrated to 77-GHz for SiP Technologies Using Embedded Wafer-Level Packaging Platform (EMWLP)

Jinglin Shi, Teck Guan Lim, Ying Ying Lim, 2010, IEEE Transactions on Advanced Packaging.