M. Feil
发表
Michael Feil,
C. Alder,
Christof Landesberger,
2003
.
A. Herland,
T. Winkler,
M. Feil,
2020,
Lab on a chip.
A. Herland,
T. Winkler,
M. Feil,
2020,
bioRxiv.
W. Mader,
M. Feil,
1991,
1991 Proceedings 41st Electronic Components & Technology Conference.
W. Mader,
M. Feil,
1991
.
K. Bock,
K. Bock,
A. Drost,
2005,
Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005..
K. Bock,
K. Bock,
M. Feil,
2004,
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).