H. Spöhrle

Ultra thin ICs and MEMS elements: techniques for wafer thinning, stress-free separation, assembly and interconnection

Michael Feil, C. Alder, Christof Landesberger, 2003 .

Mobile Electrostatic Carrier (MEC) evaluation for a GaAs wafer backside manufacturing process

C. Landesberger, K. Bock, D. Behammer, 2010 .

Backside Thinning and Stress‐Relief Techniques for Thin Silicon Wafers

C. Landesberger, K. Bock, H. Spöhrle, 2014 .

A 60 keV Implanter for Metals

H. Ryssel, K. Zeller, H. Spöhrle, 1985 .

thereof reusable carrier wafer and methods for preparing

H. Spöhrle, 2002 .