Chenxu Zhang

发表

Chenxu Zhang, Meng Wang, R. Zang, 2018, Journal of Thermal Science and Engineering Applications.

Yuping Zeng, Yongfeng Xia, K. Zuo, 2019, Journal of Materials Science & Technology.

S. Zhong, Chenxu Zhang, Zengguang Huang, 2021, AIP Advances.

A. Yu, Yongjian Wang, Chenxu Zhang, 2019, ACS biomaterials science & engineering.

Ze-Hua Zhao, Xiang-Feng Wu, Hui Li, 2017, Journal of Inorganic and Organometallic Polymers and Materials.

H. Tian, Jian Xu, Chenxu Zhang, 2021, ACS Applied Electronic Materials.

Xin Tong, Hui Wang, Xiang-Feng Wu, 2020, Journal of Wuhan University of Technology-Mater. Sci. Ed..

Li‐Song Sun, Wei-guang Zhang, Xiang-Feng Wu, 2018, Journal of Materials Science: Materials in Electronics.

Xiang-Feng Wu, Hui Li, Chenxu Zhang, 2019, Journal of Wuhan University of Technology-Mater. Sci. Ed..

Xiang-Feng Wu, Hui Li, Chenxu Zhang, 2019, Journal of Wuhan University of Technology-Mater. Sci. Ed..

Wei-guang Zhang, Xin Tong, Xiang-Feng Wu, 2018, Journal of Materials Science: Materials in Electronics.

Xiaoliang Zeng, Rong Sun, L. Ren, 2022, IEEE Transactions on Components, Packaging and Manufacturing Technology.

Yong Wang, Chenxu Zhang, Jiemei Zhou, 2022, Journal of Membrane Science.

Yong Wang, D. Ma, Jianzhong Xia, 2021, Environmental science & technology.

Yuexing Zhang, Zhengyong Huang, Xiaoliang Zeng, 2021, Composites Part A: Applied Science and Manufacturing.

Ze-Hua Zhao, Xiang-Feng Wu, Hui Li, 2018, Journal of nanoscience and nanotechnology.

H. Tian, Chenxu Zhang, Yanan Wang, 2023, Journal of Energy Chemistry.

Xiaoliang Zeng, Yimin Yao, Rong Sun, 2023, Advanced Materials Interfaces.

Hui Guo, Yimen Zhang, Chenxu Zhang, 2016, Journal of Materials Science: Materials in Electronics.

Hui Guo, Yimen Zhang, Chenxu Zhang, 2016, Journal of Materials Science: Materials in Electronics.

Xiaoying Hu, H. Tian, Chenxu Zhang, 2023, Journal of Energy Chemistry.

Xin Tong, Hui Wang, Xiang-Feng Wu, 2020, Journal of nanoscience and nanotechnology.

R. Sun, Hong He, Yuexing Zhang, 2021, International Conference on Electronic Packaging Technology.